Insulated Metal Substrate (IMS)
The use of IMS circuit boards for simple single-layer circuits is a special but very effective method of heat dissipation for components across circuit boards. These generally consist of aluminium supports, insulation layers and copper foil. The base materials are available in different design versions.
Applications:
- LED technology: Illuminated signs, displays and lighting
- Automotive industry: LED headlights, engine control and power steering
- Power electronics: DC power supply, inverters and engine control
- Switches and semi-conductor relays
Better heat dissipation than FR4
The heat generated by components such as LEDs and transistors can be easily spread and transmitted. Compared with conventional FR4 materials, the heat conductance value of the insulating layers between the copper layer and metal carrier is 5 to 10 times higher.
Manufacturers | Arlon, Bergquist, DENKA, Laird, KinWong, Ventec |
Carrier material | Aluminium, copper, stainless steel |
Metal type |
Aluminium: 1100H14, 5052H34, 6061T6 Copper: C1100, C1220 Stainless steel: SUS430 |
Panel size |
Normal: 600*457 mm Maximum: 1200*550 mm |
PCB thickness | 0.4 - 3.2 mm |
Tolerance of PCB thickness | +/- 0.10 mm |
Standard metal thickness |
0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.8 mm, 1.0 mm, 1.2 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm |
Thickness of insulating layer | 0.05 mm - 0.20 mm |
Heat conductance value | 1 W/mK - 8 W/mK |
Dielectric strength | 6 kV AC |
Copper thickness | 18 µm, 35 µm, 70 µm, 105 µm |
Track width | ≥ 150 μm |
Conductor spacing | ≥ 150 μm |
Final diameter | 0.5 mm - 6 mm |
Hole tolerance | +/- 0.075 mm |
Positional tolerance of drilled hole | +/- 0.10 mm |
Aspect ratio | 5:2 |
Solder mask dam | ≥ 100 μm |
Solder mask clearance | ≥ 50 μm |
Via clearance | ≥ 100 μm |
Conductor coverage | ≥ 50 μm |
Tolerance of outer outlines | +/- 0.10 mm |
Max. external dimensions | Length: 1200 mm, width: 530 mm |
Surface finish | HAL, LF-HAL, OSP, ENIG, Immersion Silver, Immersion Tin, ENEPIG |